Inspection system
Application After stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc.
Program mode Manual programming, auto programming, CAD data importing
Inspection Items
Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.
Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.
DIP: Missing parts, damage parts, offset, skew, inversion, etc
Soldering defect: excessive or missing solder, empty soldering, bridging, solder ball, IC,NG ,copper stain etc.
Calculation Method
Machine learning, color calculation, color extraction, gray scale operation, image contrast, OCV/OCR etc.
Inspection mode PCB fully covered, with array and bad marking function SPC statistics function
Fully record the test data and make analysis, with high flexibility to check production and quality status
Minimum component 01005 chip, 0.3 pitch IC
Optical system
Camera 5 million pix full color high speed industrial digital camera , 20 million pix camera optional
Lens resolution 10um/15um/18um/20um/25um, can be custom-made lighting source Annular stereo multi-channel color light, RGB/RGBW/RGBR/RWBR optional
Computer system
CPU Intel E3 or same level
RAM 16GB
HDD 1TB , (SSD optional)
OS Win 7.1, 64bit
Monitor 22’,16:10
Mechanic al system
Moving and inspection mode
Manual taking board in and out, Y servo motor driving PCB, X servo motor driving camera
PCB dimension 20*20mm(Min)~450*350mm(Max), can be customized
PCB thickness 0.3~5.0mm
PCB weight Max:3KG
PCB edge 3mm,can be custom-made base on need