Installationof BGA rework station
(1)Installation sites
In order to ensure that the useful life of BGA rework station, installation of repair station must meet the following conditions:
1、Away from flammable and explosive materials
2、Do not splash water or other liquids
3、Well-ventilated , dry place
4、Stable , flat areas less susceptible to vibration
5、Place less dust
6、Prohibit Placing heavy objects on top of the control box
7、Without the affect of air-conditioners, heaters and fans
8、Reserved for 30cm to move and rotate around the upper for the back of rework station
(2).Power Requirements
Use smaller voltage fluctuation power
Voltage fluctuations: 220V±10
Frequency fluctuations: 50Hz±3
- Safety Precautions of rework station
1、Do not use fans or other devices directly to the repair station hair when it works, otherwise it will lead to negative differential heating plate surface , burn the workpiece.
2、When turned on, high-temperature heating zone can not be any direct contact with the object , it may cause fire or explosion ,and the PCB workpiece should be placed on the PCB support shelves.
3、Do not shake rework station , and move gently
4、Do not touch the high fever area , otherwise it will burn
5、When turned on, do not use the flammable spray , liquid or flammable gas near the repair station.
6、Do not try to modify rework station , otherwise it will cause fire or electric shock.
7、Electrical box has the high-voltage components , do not attempt to disassemble
8、If the metal objects or liquids fall into the repair station when it works , immediately disconnect the power , unplug the power cord until the machine to cool down , then completely remove litter , dirt ; if dirt left ,there is odor when reboot.
9、When abnormal heating or smoking,immediately disconnect the power , and inform the technical service to repair.It needs to disconnect the wires between the electrical boxes and machine parts,and have to hold the plug,otherwise it leads to poor contact ,and does not work.
10、Note that the repair station not to press or run over other electrical equipment or power lines or communication cable , and it may cause device malfunction or cause fire or electric shock.
11、Before use the rework station, you must read this manual carefully
C、Structures and specifications
(1)Structures
(2)Features
Number |
Name |
Functions |
Use ways |
1 |
Limited bar |
limit the lowest position of the upper heating |
Rotate to the right place |
2 |
Up and down adjustment handle |
Adjust the upper heating of up and down position |
Rotating the handle |
3 |
Forward and back adjustment handle |
Adjust the upper heating of Forward and back position |
Rotating the handle |
4 |
Tension adjustment knob |
lock the upper heating of up and down , forward and back |
Rotate the knob |
5 |
7 handle |
lock the rotation angle of the upper heating |
Rotating the handle |
6 |
LED head light |
Lighting equipment at work |
Press the button |
7 |
Top nozzle |
Adjust the upper heating of Forward and back position |
Rotating the handle |
8 |
Bottom nozzle |
To focus the hot air |
Pull air from the BGA suitable location |
9 |
Bottom heater up and down handle |
Adjust the lower nozzle distance from the PCB board |
Rotating the handle |
10 |
Vacuum pen |
Remove the chips |
Click vacuum on the touch screen |
11 |
LED head light |
Lighting equipment at work |
Press the button |
12 |
Start button |
Start heating |
Push the button |
13 |
Emergency stop button |
Emergency stop |
Press the button |
14 |
PCB support |
Move the right position , clamping the PCB |
|
15 |
Universal fixture |
Adjust the PCB in any direction |
|
16 |
Powerful cross fan |
Cooling the PCB board after welding |
Click cooling on the touch screen |
17 |
IR preheating zone |
BGA rework with warm-up |
IR preheating zone |
18 |
Temperature sensor |
Connect an external galvanic , measure the actual temperature |
Directly connect temperature line |
19 |
Touch screen |
Data storage system platform |
|
20 |
USB interface |
Upload or download parameter |
|
(3)Specification:
Total Power |
4800W |
Top heater |
800W |
Bottom heater |
Second heater 1200W, IR preheating 2700w |
Power |
AC220V±10% 50/60Hz |
Dimensions |
64x71x60cm |
Positioning |
V-groove, PCB support can be adjusted in any direction with external universal fixture |
Temperature control |
K Sensor, Closed loop |
Temp accuracy |
±2℃ |
PCB size |
Max 450×500 mm Min 20×20 mm |
BGA chip |
2*2~80*80 |
Minimum chipspacing |
0.15mm |
External Temperature Sensor |
1(optional) |
Net weight |
45KG |
- Embedded industrial computer, high-definition touch-screen interface, CPU central processor control, and has an instant curve analysis function set and measured real-time temperature curve display, and analysis of the curve corrected
- K-type thermocouple (closed loop), heating independently, temperature precision within ±2degree
- V-groove PCB support can be adjusted in any direction with external universal fixture, suitable for all kinds of BGA repair.
- Offer all kinds of hot-air nozzle, it can rotate 360°;With magnet, easy to install and change, customized is available
- Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface
- More uniform heating, the temperature more accurately
- Powerful cross-flow fan rapidly cool the PCB board to improve efficiency; Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.
- USB interface, convenient to download the current curve. Also available for connecting with mouse.
- After finishing de-soldering & soldering, There is an alarming and alarming in advance.
- CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens;with a double overheating protection control.
D、Operations:
1、Preheat
Preheat the PCB board and BGA chip, and the temperature of constant temperature oven is set at 80 ℃-100 ℃, for 4-8 hours to remove internal moisture of the PCB and BGA, to prevent the burst phenomenon when heating.
2、Remove
Place the PCB board into the bracket on the repair station,and select the appropriate hot air reflow nozzle,and set the appropriate soldering curve,press the open button until it finishes,and then move the hot air manually,to suck the BGA chip away with the vacuum suction pen.
3、Clean-up welding
The BGA pad clean-up , one with de-soldering lineto drag flat, the second with iron;Best to remove the tin a short time after the BGA removed , then BGA has not completely cooled , and the temperature difference make less damage to the pad;use the flux can improve the activity of soldering tin,better to clean the soldering tin. Particular attention not to damage the PCB pad,and in order to ensure the reliability of BGA solder, when the cleaning pad to make use of some of the solder paste residues with more volatile solvents , such as plate washer water, industrial alcohol.
4、BGA re-balling
Wipe the paste flux equably with the brush pen on the BGA pad, choose the right steel mesh, and then plant tin beads by the re-balling kit on the right pad.
5、BGA tin beads welding
Heat the bottom heating zone of BGA re-balling station and then weld the tin beads on the pad.
6、Besmear flux
Wipe the paste flux with the brush pen on the PCB pad. If you wipe so much, it will cause connected welding, on the contrary, it will cause null welding. In order to wipe off dust and impurity of tin balls, and enhance welding effect, the welding paste must be wiped equally.
7、Place the BGA chip
Place the BGA chip on the PCB board with manual alignment and silk-screen borders, meanwhile the tension of the solder joint when melt will have a good self- alignment effect.
8、Weld
First, put the PCB board which is pasted with BGA chip on the positioning stand, and then move the hot wind head to the working place. Second, choose the appropriate backflow nozzle and set right welding temperature curve, start heating, open the switch, and then run the welding process. Besides, after the welding process is finished, you have to cool the BGA by the cooling fan. Hoist the upper hot wind head and make the bottom of hot wind nozzle apart from the surface of BGA 3-5mm, and stay 30-40 seconds, or, you can move the hot wind head after the starting switch is put out, withdraw the hot wind head.Finally, take away the PCB board from the heating zones.
(1)null welding:
Because of counterpoint by hand will cause deviation between chip and welding plate, surface tension of tin ball will make BGA chip and welding plate in the process of automatic correction. Once heating, BGA falls not evenly, which cause the chip drops not evenly.If stop reflowing at this time, the chip will not fall normally,which will cause the phenomenon of empty welding and false welding.So you need to extent time of third 、forth temperature zones or add the bottom pre-heating temperature to make ,the tin balls meltdown and drop evenly.
(2)short circuit:
When the ball reached the melting point,it is in a liquid state , if too long or too high temperature and pressure,it will destroy surface tension of solder balls and the supporting role, resulting in short-circuit phenomenon when reflows,the chips fall entirely on the PCB pads the , so we need to appropriately reduce the heating section of the third and fourth soldering temperature and time , or reduce the bottom of the preheat temperature.